Magazine Publications: 1. "Architectures: Small,robust flash cell claims easy integration" EETimes p.42, May 24th 2005. By:Ron Wilson. Article1 2. "Microchip's E2PROM twisttouts speed, density gain" EETimes p.8, Aug. 27th 2001. By:Anthoney Catado. Article2. . 3. "Microchip packs more punch in new 8-bit controller line" -Mark LaPedu, Dec. 1st 2003. at web: www.eetimes.com/news/latest/showArticle.jhtml?articleID=16401018 . 4." Microchip puts EEPROMs in ant-sized package" EETimes -Silion Strategies. Jan 21st 2002. atweb: www.eetimes.com/news/latest/showArticle.jhtml?articleID=10802484 . 5."Microchip develops new flash technology to cut cost of re-programmable MCUs" EETimes-Silicon strategies. Sept.4th 2001. at web: www.eetimes.com/news/latest/showArticle.jhtml?articleID=10809500
Conference Articles   1.                  Mammen Thomas and Jagdish Pathak, MEMTEK,LLC; “A manufacturable and Embeddable Non-Volatile Memory for High Temperature and High Reliability applications – Development and Characterization information” MRQW (Microelectronics Reliability and Qualification Workshop); Dec 6th,2006, Los Angeles, California.   2.                  Fredrick Peter Lisenberger, Gregor Shatzberger, Andreas Wiesner, Peter Bosmuller, and Ewald Wachmann of Austriamicrosystems AG; Mammen Thomas and Jagdish Pathak of MEMTEK,LLC; “Development of a Non Volatile Embedded Memory Technology for High Temperature and High Reliability Applications”. Austrochip 2006; Oct. 11th 2006, Vienna.   3.                  Mammen Thomas, Jagdish Pathak and Jim Payne, MEMTEK,LLC; F. Leisenberger, E. Wachmann, G. Schatzberger, A. Wiesner, M. Schrems, Austriamicrosystems AG; “Development of a Non-Volatile Memory Meeting Automotive Temperature & Reliability Requirements and Results”IMAPS International Conference on High Temperature Electronics (HiTEC 2006; May 15th 2006, Santa Fe, New Mexico.   4.                   Mammen Thomas, Jagdish Pathak, and Jim Payne; MEMTEK, LLC; Gregor Schatzberger, Andreas Wiesner, Friedrich Leisenberger, Ewald Wachmann and Martin Schrems, austriamicrosystems AG, “A Non-Volatile Embedded Memory for High Temperature Automotive and High-Retention Applications”; ISQED (7th IEEE International Symposium on Quality Electronic Design); March 27th 2006, San Jose, California.   5.                  Jagdish Pathak, Mammen Thomas, and Jim Payne, MEMTEK, LLC; Gregor Schatzberger, Andreas Wiesner, Friedich Leisenberger, Ewald Wachman, and Martin Schrems, Austriamicrosystems, AG; “Embedded Non-Volatile Memory modules for low voltage and high temperature applications”; NVSMW (The 21st IEEE Nonvolatile Semiconductor Memory Workshop); Feb. 12th 2006, Monterey, California.